The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-C101-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Mon. Mar 19, 2018 9:15 AM - 11:45 AM C101 (52-101)

Kuniyuki Kakushima(Titech)

11:15 AM - 11:30 AM

[19a-C101-9] SiC Nanodots Formation in Bulk-Si using Hot C+ Ion Implantation Substrate (Ⅲ):C Dose Dependency

Sho Irie1, 〇Masaki Yamamoto1, Sinji Nakada1, Yusuke Omata1, Takashi Aoki1, Toshiyuki Sameshima2, Tomohisa Mizuno1 (1.Kanagawa Univ., 2.Tokyo Univ Agri. Tech.)

Keywords:SiC, hot ion impantation, quantum dot