The 65h JSAP Spring Meeting, 2018

Sessions

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Oral presentation

[17a-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Sat. Mar 17, 2018 9:30 AM - 12:30 PM C101 (52-101)

Takashi Noguchi(Univ. of the Ryukyus)

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Oral presentation

[17p-C101-1~6] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Sat. Mar 17, 2018 4:00 PM - 5:30 PM C101 (52-101)

Seiichiro Higashi(Hiroshima Univ.)

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Oral presentation

[19a-C101-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Mon. Mar 19, 2018 9:15 AM - 11:45 AM C101 (52-101)

Kuniyuki Kakushima(Titech)

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Oral presentation

[20a-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Mar 20, 2018 9:15 AM - 12:15 PM C101 (52-101)

Masato Sone(Titech)

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Oral presentation

[20p-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Mar 20, 2018 1:45 PM - 4:45 PM C101 (52-101)

Reo Kometani(Univ. of Tokyo)

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Poster presentation

[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Sat. Mar 17, 2018 1:30 PM - 3:30 PM P7 (P)

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▲:英語発表
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