Toshifumi Konishi

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Speaker, Author, Co-Author

Sat. Mar 17, 2018 1:30 PM - 3:30 PM P7 (P)

Poster presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

1:30 PM - 3:30 PM

[17p-P7-10] Temperature Dependence on Package Sealing Ambient of MEMS Inertial Sensor Fabricated by Multi-layer Metal Technology

〇Toshifumi Konishi^1,2, Daisuke Yamane², Teruaki Safu¹, Chun-Yi Chen², Tso-Fu Mark Chang², Hiroyuki Ito², Shiro Dosho², Noboru Ishihara², Masato Sone², Katsuyuki Machida², Kazuya Masu², Shinichi Iida¹ (1.NTT-AT, 2.Tokyo Tech.)

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