[20a-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20a-C101-11] Fabrication of SAW resonators on single-crystal diamonds using Minimal-Fab process II

Masaya Negawa¹, Hiroki Kamehama¹, 〇Satoshi Fujii^1,2, Haruki Toonoe³ (1.NIT, Okinawa Coll., 2.Tokyo Tech, 3.Yokogawa S. S. Corp.)

Keywords:SAW resonators, Minimal-Fab, diamond

Diamond is known to have the highest sound velocity of all materials, and therefore, has been applied to high frequency surface acoustic wave (SAW) devices in the gigahertz range. However, single crystal diamond wafers of only up to two-inch in diameter have been realized; in consequence, diamond SAW resonators were far fromcommercial development. A novel CMOS device fabrication system developed by Hara et al., called the Minimal-Fab process, was thus applied in the fabrication of SAW resonators. We discuss the potential of the Minimal-Fab process, and our fabrication of diamond SAW resonators using a half-inch diamond wafer.