The 65h JSAP Spring Meeting, 2018

Presentation information

Print

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20a-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Mar 20, 2018 9:15 AM - 12:15 PM C101 (52-101)

Masato Sone(Titech)

10:15 AM - 10:30 AM

▼ [20a-C101-5] Electrical Conduction Property at Metal/Heavily Sb-doped n-Ge1−xSnx Contact

〇Jihee Jeon1, Akihiro Suzuki1,2, Kouta Takahashi1,2, Osamu Nakatsuka1,3, Shigeaki Zaima3 (1.Grad. Sch. of Eng., Nagoya Univ., 2.Research Fellow of JSPS, 3.IMaSS, Nagoya Univ.)

Keywords:GeSn, contact resistivity, Metal/Semiconductor interface