The 65h JSAP Spring Meeting, 2018

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Sat. Mar 17, 2018 1:30 PM - 3:30 PM P7 (P)

1:30 PM - 3:30 PM

[17p-P7-8] The Effect of SnO2 on Mechanical Properties of Electroplated Sn

Hizuki Taoka1, Mana Tanabe1, Chun-Yi Chen1, Tso-Fu Mark Chang1, Masato Sone1 (1.Tokyo Tech.)

Keywords:Sn electroplating, Vickers Hardness, Tin Oxide