[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [17p-P7-7] Measurement of Young’s Modulus with Ti/Au Micro-Cantilevers

〇Hideaki Nakajima¹, Tso-Fu Mark Chang¹, Chun-Yi Chen¹, Daisuke Yamane¹, Toshifumi Konishi^1,2, Katsuyuki Machida¹, Hiroshi Toshiyoshi³, Kazuya Masu¹, Masato Sone¹ (1.Tokyo Tech., 2.NTT-AT, 3.The Univ. of Tokyo)

Keywords:MEMS, Gold, young's modulus