The 65h JSAP Spring Meeting, 2018

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Sat. Mar 17, 2018 1:30 PM - 3:30 PM P7 (P)

1:30 PM - 3:30 PM

[17p-P7-11] A Study on Brownian Noise Evaluation of High-sensitivity MEMS Accelerometers

Hirofumi Niijima1, Shota Otobe1, Motohiro Takayasu1, Daisuke Yamane1, Toshifumi Konishi1,2, Teruaki Safu2, Hiroyuki Ito1, Hiroshi Toshiyoshi3, Katsuyuki Machida1, Kazuya Masu1 (1.Tokyo Tech, 2.NTT-AT, 3.Univ. of Tokyo)

Keywords:MEMS accelerometer, Brownian Noise, Multi-layer Metal Technology