The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-C101-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Mon. Mar 19, 2018 9:15 AM - 11:45 AM C101 (52-101)

Kuniyuki Kakushima(Titech)

9:15 AM - 9:30 AM

[19a-C101-1] Highy sensitive thermal stress detection using elastically center coupled nanomechanical resonator

Kodai Tanaka1, Etsuo Maeda1, Shin-ichi Warisawa1,2, Reo Kometani1,2 (1.Grad. Sch. of Eng., Univ. of Tokyo, 2.Grad. Sch. of Front. Sci., Univ. of Tokyo)

Keywords:resonator, NEMS, thermal stress sensor

An elastically center coupled nanomechanical resonator was proposed in order to achieve Q factor independent thermal stress detection for the high resonation wavelength measurement. Nanomechanical resonator was fabricated by using focused ion beam ion implantation and wet-etching. As a result, we demonstrated that an elastically center coupled nanomechanical resonator enables the high sensitive detection of thermal stress.