The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[19a-C101-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Mon. Mar 19, 2018 9:15 AM - 11:45 AM C101 (52-101)

Kuniyuki Kakushima(Titech)

10:45 AM - 11:00 AM

[19a-C101-7] Ar+ ion implantation used to reduce temperature for activating B atoms implanted in silicon

Keisuke Yasuta1, Takuma Uehara1, Masahiko Hasumi1, Tomokazu Nagao2, Yutaka Inouchi2, Toshiyuki Sameshima1 (1.TUAT, 2.NISSIN ION EQUIPMENT Co.)

Keywords:ion implantation, low temperature activation