Toru Mannami

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Speaker, Author, Co-Author

Tue. Mar 20, 2018 1:45 PM - 4:45 PM C101 (52-101)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20p-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

4:15 PM - 4:30 PM

[20p-C101-10] Development of Fan-Out type RDL package using minimal package processes

〇Toru Mannami¹, Hiroko Kaneko¹, Nobuyoshi Yamauchi¹, Masanori Iwata¹, Kenji Miyake¹, Takafumi Yoshinaga², Sommawan Khumpuang³, Shiro Hara³ (1.PMT, 2.KUMAMOTO BOSEI, 3.AIST)

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