The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20p-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Mar 20, 2018 1:45 PM - 4:45 PM C101 (52-101)

Reo Kometani(Univ. of Tokyo)

4:15 PM - 4:30 PM

[20p-C101-10] Development of Fan-Out type RDL package using minimal package processes

Toru Mannami1, Hiroko Kaneko1, Nobuyoshi Yamauchi1, Masanori Iwata1, Kenji Miyake1, Takafumi Yoshinaga2, Sommawan Khumpuang3, Shiro Hara3 (1.PMT, 2.KUMAMOTO BOSEI, 3.AIST)

Keywords:minimal fab, redistribution layer, semiconductor

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