[20p-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20p-C101-10] Development of Fan-Out type RDL package using minimal package processes

〇Toru Mannami¹, Hiroko Kaneko¹, Nobuyoshi Yamauchi¹, Masanori Iwata¹, Kenji Miyake¹, Takafumi Yoshinaga², Sommawan Khumpuang³, Shiro Hara³ (1.PMT, 2.KUMAMOTO BOSEI, 3.AIST)

Keywords:minimal fab, redistribution layer, semiconductor