[17a-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [17a-C101-10] Single Crystalline Silicon CMOS Circuit Fabrication on Flexible Substrate by Meniscus Force Mediated Layer Transfer Technique

〇Ryutatsu Mizukami¹, Tomonori Yamashita¹, Seiichiro Higashi¹ (1.ADSM, Hiroshima Univ.)

Keywords:flexible electronics, single crystalline silicon CMOS circuit, plastic substrate