Yui Ito

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Speaker, Author, Co-Author

Sat. Mar 17, 2018 1:30 PM - 3:30 PM P7 (P)

Poster presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

1:30 PM - 3:30 PM

[17p-P7-18] Evaluation of resister characteristics for chip on chip bonding using "Au" stud bumps and concave shape electrode with ACP

〇Yui Ito¹, Masahiro Akiyama¹ (1.NIT,Nagano College)