The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20a-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Mar 20, 2018 9:15 AM - 12:15 PM C101 (52-101)

Masato Sone(Titech)

11:00 AM - 11:15 AM

[20a-C101-7] Fabrication of Submicron Gate Minimal SOI-CMOS Using Gate-First Process

Yongxun Liu1, Kazushige Sato2, Hiroyuki Tanaka1,2, Kazuhiro Koga2, Sommawan Khumpuang1,2, Masayoshi Nagao1, Takashi Matsukawa1, Shiro Hara1,2 (1.AIST, 2.MINIMAL)

Keywords:Minimal-fab, Submicron gate

So far, we have developed the minimal SOI-CMOS by using the SOI (Spin on dopant) thermal diffusion based gate-last process. In this work, we fabricated and characterized the minimal SOI-CMOS by using ion implantation based gate-first process.