Haochun Tang

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Speaker, Author, Co-Author

Sat. Mar 17, 2018 1:30 PM - 3:30 PM P7 (P)

Poster presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

1:30 PM - 3:30 PM

△ [17p-P7-9] Fabrication of Au–Cu Alloys for MEMS Applications by Electroplating Method and Its Micro-mechanical Property

〇(DC)Haochun Tang¹, Chun-Yi Chen¹, Tso-Fu Mark Chang¹, Daisuke Yamane¹, Toshifumi Konishi^1,2, Katsuyuki Machida¹, Kazuya Masu¹, Masato Sone¹ (1.IIR, Tokyo Tech, 2.NTT AT)

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