[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [17p-P7-9] Fabrication of Au–Cu Alloys for MEMS Applications by Electroplating Method and Its Micro-mechanical Property

〇(DC)Haochun Tang¹, Chun-Yi Chen¹, Tso-Fu Mark Chang¹, Daisuke Yamane¹, Toshifumi Konishi^1,2, Katsuyuki Machida¹, Kazuya Masu¹, Masato Sone¹ (1.IIR, Tokyo Tech, 2.NTT AT)

Keywords:gold copper alloy, electroplating, micro-compression test