[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-P7-10] Temperature Dependence on Package Sealing Ambient of MEMS Inertial Sensor Fabricated by Multi-layer Metal Technology

〇Toshifumi Konishi^1,2, Daisuke Yamane², Teruaki Safu¹, Chun-Yi Chen², Tso-Fu Mark Chang², Hiroyuki Ito², Shiro Dosho², Noboru Ishihara², Masato Sone², Katsuyuki Machida², Kazuya Masu², Shinichi Iida¹ (1.NTT-AT, 2.Tokyo Tech.)

Keywords:MEMS inertial sensor, temperature dependence, sealing ambient

We have developed a highly-sensitive MEMS inertial sensor fabricated by gold multi-layer metal technology. To apply our sensor to the applications such as human motion monitoring or postural control of consumer electronics, it is necessary to investigate the relationships between device behaviors and sealing ambient. This work reports temperature dependence on package sealing ambient for our fabricated sensors.