The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[19p-C204-1~17] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Mon. Mar 19, 2018 1:45 PM - 6:15 PM C204 (52-204)

Hisataka Hayashi(TOSHIBA), Yoshihide Kihara(Tokyo Electron Miyagi Limited)

3:45 PM - 4:00 PM

[19p-C204-9] Electronic properties and dissociation channels of C2HxFy compounds(II)

Toshio Hayashi1, Kenji Ishikawa1, Makoto Sekine1, Masaru Hori1 (1.Nagoya Univ. Plasma nano Technology Center)

Keywords:SiNx etching, Hydrofluoroethane, computational chemistry

CH2F2 is mainly used in reactive ion etching for silicon nitride film. However, the important species for silicon nitride etching (CHxFy) are produced from many other compounds. Therefore, we investigated electronic properties and product channels of CH2FCH2F and CH2FCHF2 gases using computational chemistry. The results shows that CHxFy species are also produces from these compounds.