The 65h JSAP Spring Meeting, 2018

Presentation information

Symposium (Oral)

Symposium » Visualizing a brilliant future for Japanese semiconductor industry & Research

[19p-G201-1~10] Visualizing a brilliant future for Japanese semiconductor industry & Research

Mon. Mar 19, 2018 1:15 PM - 5:35 PM G201 (63-201)

Osamu Nakatsuka(Nagoya Univ.), Noriyuki Taoka(AIST)

1:20 PM - 1:50 PM

[19p-G201-2] Advanced Imaging Device Technologies and the Future for Sensing Technologies

Koji Neya1, Hidenobu Tsugawa1, Itaru Oshiyama1, Yoshiki Ebiko1, Keiji Tatani1, Keiichi Ohno1, Hiroyuki Miwa1 (1.Sony Semiconductor)

Keywords:CMOS Image Sensor, Stacked CIS, Active Sensing

Back illuminated stacked CMOS image sensor (CIS) for Smartphone has been grown up to satisfy both of downsizing and high quality imaging. More recently, we have developed high frame rate CIS to suppress rolling shutter distortion and near-Infrared high sensitivity CIS for active sensing. Therefore, we explain trend and future imaging device technologies for conventional uses and new sensing applications.