Yuki Miwa

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Speaker, Author, Co-Author

Thu. Sep 19, 2019 9:00 AM - 12:00 PM E304 (E304)

Oral presentation
| 13 Semiconductors
| 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[19a-E304-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

11:15 AM - 11:30 AM

△ [19a-E304-10] Low-height microbump bonding for 3D integration with fine-pitch electrodes

〇Yuki Miwa¹, Sungho Lee², Rui Liang¹, Kousei Kumahara¹, Hisashi Kino³, Takafumi Fukushima², Tetsu Tanaka^1,2 (1.Grad. Sch. of Biomedical Engineering, Tohoku Univ., 2.Grad. Sch. of Engineering, Tohoku Univ., 3.FRIS, Tohoku Univ.)

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