Kousei Kumahara

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Speaker, Author, Co-Author

Thu. Sep 19, 2019 9:00 AM - 12:00 PM E304 (E304)

Oral presentation
| 13 Semiconductors
| 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[19a-E304-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

11:45 AM - 12:00 PM

△ [19a-E304-12] Microbump Bonding Technology for Multichip-to-Wafer 3D Integration

〇Kousei Kumahara¹, Miwa Yuki¹, Lee Sungho², Liang Rui¹, Kino Hisashi³, Fukushima Takafumi^1,2, Tanaka Tetsu^1,2 (1.Grad. sch. of biomedical eng., Tohoku Univ., 2.Grad. sch. of eng., Tohoku Univ., 3.FRIS, Tohoku Univ.)

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