[18p-E304-1~10] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[18p-E304-8] Silicon filling in nano space using liquid silicon

〇TAKASHI MASUDA¹, Yuki Usui², Takahiro Kishioka² (1.JAIST, 2.Nissan Chemical Co.)

Keywords:liquid silicon, filling

In silicon (Si) semiconducting processes, Si filling technology into a nano spece in trench, pore, or gap, is demanded. In this research, nano space with the size of 20 nm or less was filled by semiconductor Si using capillary force of liquid-Si which is liquid precursor for semiconductng Si. Liquid-Si penetrated spontaneously into the contacted nanospace by capillary force, then converted into solid Si by heating.