[19p-PB2-1~7] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[19p-PB2-5] SOI-Si/4H-SiC pixel array fabrication process for radiation hardened image sensors

〇Tatsuya Meguro¹, Fumiaki Hasebe¹, Akinori Takeyama², Takeshi Ohshima², Yasunori Tanaka³, Shin-Ichiro Kuroki¹ (1.RNBS, 2.QST, 3.AIST)

Keywords:rad-hard, wafer bonding, image sensor