[19p-PB7-1~16] 12.1 Fabrications and Structure Controls

[19p-PB7-6] Improvement of Organic-Metal Interface by Self-Assenbled Monolayer

〇Takuya Izumi¹, Takaki Saitoh¹, Hiroaki Usui¹, Satoshi Usui² (1.Tokyo Univ. Agri. & Tech., 2.Niigata Univ.)

Keywords:deposition, thin film, self-assembled monolayer

It was thought that the carrier injection barrier could be lowered by inserting a covalent bond at the organic-metal interface. The bonding point with the organic semiconductor was formed by chemically modifying the surface of the Al substrate using a silane coupling agent. Although the increase in conductivity was observed by the bond formation, it was revealed that the influence of the thin film structure was significant. Therefore, it may be necessary to study the structure in the thin film.