[20a-E306-1~12] 8.5 Plasma phenomena, emerging area of plasmas and their new applications

[20a-E306-12] Vacuum breakdown of oxygen-free copper electrodes with periodic grooves fabricated by lithographic process

〇(M1)Ryoma Tada¹, Tetsuya Hoshino¹, Souichi Katagiri¹, Yasushi Yamano^1,2, Masahiro Yamamoto^1,3, Masahide Itoh¹ (1.Univ. of Tsukuba, 2.Saitama Univ., 3.KEK)

Keywords:vacuum breakdown, electrode surface shape, lithographic process

The discharge damages high-voltage equipment, and breakdown voltage by the discharge in vacuum is affected by the shape of convex on the electrode surface. In the previous research, the surface shape was limited to random one, and the shape factor affecting breakdown voltage was not clear. Therefore, we made and evaluated ultra-smooth surface whose roughness was several nanometers by chemical mechanical polishing, and fabricated periodic grooves with easy shape definition on oxygen-free copper electrode surface by interference exposure and lithographic process. Using this electrode, we conducted gap breakdown test in vacuum.