[20a-E314-1~8] 16.3 Bulk, thin-film and other silicon-based solar cells

△ [20a-E314-6] Slicing damage evaluation for thin flexible Si solar cells

〇(M2)Kouhei Onishi¹, Ryo Yokogawa^1,5, Tappei Nishihara¹, Takefumi Kamioka¹, Kyotaro Nakamura², Yoshio Ohshita², Kawatsu Tomoyuki³, Nagai Toshiki³, Yamada Noboru⁴, Yukio Miyashita⁴, Atsushi Ogura¹ (1.Meiji Univ., 2.Toyota Tech. Inst., 3.Komatsu NTC Ltd., 4.Nagaoka University of Technology., 5.JSPS Research Fellow DC)

Keywords:Solar cell

Multiwire diamond sawing has become main stream for wafer slicing in Si solar cell industry because of its high productivity. However, the well-controlled slicing conditions are strongly desired to reduce wafer breakage especially for the thinner wafers less than 100 mm. The thinner wafer may be more flexible to install on the complicated curvature such as vehicle body for the solar driven automobile if the sawing damage can be sufficiently suppressed. In the present study, we established diamond wire sawing conditions for the thin wafers and found that the wafer less than 100 mm was significantly flexible without breakage. Furthermore, the wafers were sufficiently ready for the reasonable cell efficiency.