[20p-PA7-1~8] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

△ [20p-PA7-3] Chip embedment technology using RDL-first FOWLP for hydrogel-based FHE

〇(M1)Noriyuki Takahashi¹, Yuki Susumago², Hisashi Kino³, Tetsu Tanaka^1,2, Takahumi Fukushima^1,2 (1.Grad. sch. of biomedical eng., Tohoku Univ., 2.Grad. sch. of eng., Tohoku Univ., 3.FRIS, Tohoku Univ.)

Keywords:hydrogel, flexible hybrid electronics