Sungho Lee

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Speaker, Author, Co-Author

Sun. Mar 10, 2019 1:45 PM - 5:00 PM S221 (S221)

Oral presentation
| 13 Semiconductors
| 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[10p-S221-1~10] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

4:15 PM - 4:30 PM

△ [10p-S221-8] Technology Platform Development of Multichip-to-Wafer 3D Integration (1)
- Multichip Thinning Technology with Temporary Adhesive -

〇Sungho Lee¹, Rui Liang², Yuki Miwa³, Hisashi Kino⁴, Takafumi Fukushima¹, Tetsu Tanaka^1,2 (1.Grad. Sch. of Engineering, Tohoku Univ., 2.Grad. Sch. of Biomedical Engineering, Tohoku Univ., 3.Sch. of Engineering Tohoku Univ., 4.FRIS, Tohoku Univ.)