Liu Bai

Speaker, Author, Co-Author

Sun. Mar 10, 2019 9:15 AM - 12:15 PM W331 (W331)

Oral presentation
| Code-sharing session
| 【CS.4】Code-sharing Session of 3.15 & 3.16

[10a-W331-1~10] CS.4 Code-sharing Session of 3.15 & 3.16

11:45 AM - 12:00 PM

▼ [10a-W331-9] Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding

〇Liu Bai¹, Takehiko Kikuchi^1,3, Takuya Mitarai¹, Nobuhiko Nishiyama^1,2, Hideki Yagi³, Tomohiro Amemiya^1,2, Shigehisa Arai^1,2 (1.Tokyo Tech, 2.IIR, 3.SEI)

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