Yusufu Ekubaru

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Speaker, Author, Co-Author

Mon. Mar 11, 2019 9:30 AM - 11:30 AM PB3 (PB)

Poster presentation
| 13 Semiconductors
| 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[11a-PB3-1~11] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

9:30 AM - 11:30 AM

[11a-PB3-5] Reliability of Ni diffusion barrier on the semiconductor junction of Bi-Te based thermoelectric device

〇Yusufu Ekubaru¹, Tohru Sugahara¹, Katsuaki Suganuma¹, Michio Okajima², Shutaro Nambu² (1.ISIR Osaka Univ., 2.E-ThermoGentek)