The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[10a-M121-1~10] 13.7 Compound and power electron devices and process technology

Sun. Mar 10, 2019 9:00 AM - 11:45 AM M121 (H121)

Kenji Shiojima(Univ. of Fukui)

9:45 AM - 10:00 AM

[10a-M121-4] Evaluation of Temperature-Dependent Stress in GaN HEMT by Raman Spectroscopy

Tomoyuki Uchida1, Ryuichi Sugie1 (1.Toray Research Center)

Keywords:stress, Raman, Galium Nitride

We evaluated the temperature dependence of the stress in GaN HEMT. The measurement points are located under the source electrode and gate electrode in the cross section of the GaN HEMT. We investigated the temperature-dependent stress and determined the stress components at each temperature. The horizontal stress largely changed as the temeperature changed, and the compressive stress increased at high temperature. In my presentation, I will discuss about the mechanism of the temperature-dependent stress.