The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

22 Joint Session M ”Phonon Engineering” » 22.1 Joint Session M "Phonon Engineering"

[10a-W371-1~12] 22.1 Joint Session M "Phonon Engineering"

Sun. Mar 10, 2019 9:00 AM - 12:15 PM W371 (W371)

Junichiro Shiomi(Univ. of Tokyo), Toshio Baba(JST)

11:00 AM - 11:15 AM

[10a-W371-8] Thermal conductivity measurement of suspended graphene by heat spreader method.

〇(D)Mayeesha Masrura Haque1, Seiya Kubo1, Manoharan Muruganathan1, Shinichi Ogawa2, Hiroshi Mizuta1,3 (1.JAIST, 2.AIST, 3.Hitachi Cam. Lab)

Keywords:Thermal phonon transport, Suspended graphene, Heat spreader method

Recent studies on the control and manipulation of thermal phonons show that specifically designed periodic arrays can reduce the thermal transport through a material by suppressing the transmission of a certain phonon wavelength. It has been observed by finite element method (FEM) simulations that, in case of graphene, periodic nanopores with sub-10 nm pitch exhibit phononic band gap in the low THz regime. Recently, periodic arrays of 3-4 nm sized pores have been successfully nanopatterned in suspended graphene by focused helium ion beam milling (HIM). In order to understand the influence of such periodic nanopores on the transmission of THz phonon, we are working on establishing a characterization platform to be able to measure practically the in-plane thermal conductivity of the suspended graphene. Heat spreader method uses microfabricated metal lines to create thermal gradient through the sample and resistance thermometry is used for in plane thermal transmission measurement. The process of fabrication and primary test execution of our thermal measurement system will be presented in this research work. The heaters and thermometers are fabricated on a silicon substrate using e-beam lithography (EBL). To separate graphene from the conducting metal layer, the transfer and patterning of an insulating layer of hexagonal boron nitride (hBN) is being carried out. Also, we are working on the transfer and patterning of the graphene layer for HIM milling. The optimization of lithography conditions is extremely crucial at this point. We are also conducting experiments to understand the operational condition of our thermal measurement system.