The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

Code-sharing session » 【CS.5】Code-sharing Session of 6.1 & 13.3 & 13.5

[10p-W631-1~12] CS.5 Code-sharing Session of 6.1 & 13.3 & 13.5

Sun. Mar 10, 2019 1:45 PM - 5:00 PM W631 (W631)

Masaharu Kobayashi(Univ. of Tokyo), Takao Shimizu(Tokyo Tech), Shosuke Fujii(Toshiba Memory)

2:15 PM - 2:30 PM

[10p-W631-3] The influence of sputtering condition for ferroelectric HfO2 directly deposited on Si(100) by RF magnetron sputtering

MinGee Kim1, Masakazu Kataoka1, Rengie Mark D. Mailig1, Shun-ichiro Ohmi1 (1.Tokyo Tech.)

Keywords:HfO2, ferroelectric, RF magnetron sputtering

Nowadays, the ferroelectric HfO2 is widely investigated because of its Si CMOS compatibility. To reduce the depolarization field, direct deposition of HfO2 with low-temperature annealing process is necessary. In previous research, the control of gas flow ratio for reactive sputtering realized ferroelectric characteristics of undoped HfO2 directly deposited on Si(100) substrates.
In this research, we investigated the effect of sputtering condition to improve the electrical characteristics of HfO2/Si(100) structure.