[11a-PA2-1~17] 3.2 Equipment optics and materials

[11a-PA2-5] Patterning of Transparent Conductive Films by the Laser Ablation Method

Ryota Igarashi¹, 〇Mitsunori Saito¹ (1.Ryukoku Univ.)

Keywords:Transparent conductive film, Laser processing, Wiring

A transparent conductive film (ITO) on a glass plate was machined by the use of a pulsed laser beam to create a wiring pattern. Laser pulses with a duration of 8 ns and an energy of 7 μJ were irradiated on the glass plate at a rate of 2000 pulse/s. The laser beam was focused by a lens with a focal length of 5 mm. When the glass plate was moved on the focal plane at a velocity of 5 mm/s, an ablation trace of 8 μm width was formed on the glass plate due to the removal of the conductive film. A wiring pattern of 30 μm width was created successfully by using this technique.