The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

1 Interdisciplinary Physics and Related Areas of Science and Technology » 1.3 Novel technologies and interdisciplinary engineering

[11p-PA2-1~10] 1.3 Novel technologies and interdisciplinary engineering

Mon. Mar 11, 2019 1:30 PM - 3:30 PM PA2 (PA)

1:30 PM - 3:30 PM

[11p-PA2-3] Design and fabrication of mechanical metamaterials for flexible electronic devices

Bongkyun Jang1, Kwang-Seop Kim1, Byung-Ik Choi1, Jae-Hyun Kim1, Hak-Joo Lee1 (1.KIMM)

Keywords:Mechanical metamaterial, Flexible electronics, Thin film

Mechanical metamaterial is artificial structures with mechanical properties defined by their structures rather than their compositions. So far, a lot of examples of the mechanical metamaterials are suggested such as acoustic/phononic metamaterials, materials with negative poisson’s ratio, materials with negative longitudinal and volume compressibility transitions and penta mode metamaterials or meta-fluids [1]. In this study, we designed mechanical metamaterials for flexible electronic applications. Using finite element method, kirigami patterns are analyzed for design of flexible substrates. Numerical simulations demonstrate the deformation of flexible substrates. As a flexible substrate, we use polymeric sheet and we made kirigami patterns using laser cutting process. On the mechanical meta structure of flexible substrate, we transferred thin devices based on semiconducting materials.
[1] Zadpoor, A. A. Mechanical meta-materials, Mater. Horiz., 2016, 3, 371