[12a-PB3-1~16] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

△ [12a-PB3-11] Fabrication of Au-Cu Alloy Micro-Cantilever by Electrodeposition

〇Kyotaro Nitta¹, Haochun Tang¹, Chun-Yi Chen¹, Tso-Fu Mark Chang¹, Daisuke Yamane¹, Toshifumi Konishi^1,2, Katsuyuki Machida¹, Hiroyuki Ito¹, Kazuya Masu¹, Masato Sone¹ (1.Tokyo Tech., 2.NTT-AT)

Keywords:MEMS, gold, alloy