The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[12a-PB3-1~16] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Tue. Mar 12, 2019 9:30 AM - 11:30 AM PB3 (PB)

9:30 AM - 11:30 AM

[12a-PB3-10] Micro-Bending Test of Gold Micro-Cantilevers and the effect of thickness

Kosuke Suzuki1, Ken Hashigata1, Keisuke Asano1, Chun-Yi Chen1, Takashi Nagoshi2, Tso-Fu Mark Chang1, Daisuke Yamane1, Toshifumi Konishi1,3, Katsuyuki Machida1, Hiroyuki Ito1, Kazuya Masu1, Masato Sone1 (1.Tokyo tech, 2.AIST, 3.NTT AT Corp)

Keywords:MEMS, gold