The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

9 Applied Materials Science » 9.4 Thermoelectric conversion

[9a-PA1-1~13] 9.4 Thermoelectric conversion

Sat. Mar 9, 2019 9:30 AM - 11:30 AM PA1 (PA)

9:30 AM - 11:30 AM

[9a-PA1-2] Evaluation of Seebeck coefficient of Si wire by KFM

Yuhei Suzuki1, Akito Oka1, Taketo Kawai1, Yuya Himeda2, Hiroki Takezawa2, Motohiro Tomita2, Hirokazu Tatsuoka1, Takashi Matsukawa3, Takeo Matsuki2,3, Takanobu Watanabe2, Hiroshi Inokawa1, Masaru Shimomura1, Kenji Murakami1, Faiz Salleh4, Hiroya Ikeda1 (1.Shizuoka Univ., 2.Waseda Univ., 3.AIST, 4.Univ. of Malaya)

Keywords:Kelvin-probe force microscopy, Seebeck coefficient, Si

In order to actually measure the Seebeck coefficient with using a kelvin-probe force microscopy, a Si wire equipped with a pad for temperature measurement was prepared, and surface potential was measured. The potential difference of 15 mV was obtained between the both ends of wire originated from the temperature gradient. The temperature difference between the pads was estimated to be 6 K. As a result, Seebeck coefficient was evaluated as -2.5 mV/K. This value was about 10 times larger than that of bulk Si with the same carrier concentration. This cause is under consideration with an analysis of electron distribution simulation.