The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

12 Organic Molecules and Bioelectronics » 12.3 Functional Materials and Novel Devices

[9a-PA2-1~40] 12.3 Functional Materials and Novel Devices

Sat. Mar 9, 2019 9:30 AM - 11:30 AM PA2 (PA)

9:30 AM - 11:30 AM

[9a-PA2-24] Development of Low-pressure Electrical Interconnection Technology toward Flexible Electronics

Kousuke Matsuo1, Ken Onishi1, Shinichi Inayoshi1, Atsushi Kira1, Shin-ichiro Nakajima1 (1.Japan Aviation Electronics Ind.)

Keywords:flexible, connector, electrical interconnection technology

We developed the low-pressure electrical interconnection technology toward flexible electronics which is expected to expand the range of application of electronics due to its flexibility. In this study, we fabricated the electrical interconnection structure of the metalized elastic body having many fine convex structures, and measured contact resistance applying the load. The developed interconnection technology showed it can be realized more stable electrical interconnection in the low pressure region because it has a large effective contact area.