[9p-PB2-1~12] 3.7 Laser processing

[9p-PB2-3] Aberration Effect on the Laser Nano-Processing of Semiconductor

Satoki Suzuki¹, 〇Mitsunori Saito¹ (1.Ryukoku Univ.)

Keywords:Laser ablation, Semiconductor, Nano-structure

Processes of laser ablation and alkaline etching were combined to create a polygonal pit array on a silicon plate. A pico-second laser beam of 532 nm wavelength was focused on the plate by using a lens with a focal length of 5 mm. Thin, deep ablation traces were producible at a position above the focal point due to a spherical aberration of the lens. The circular traces turned to hexagonal pits of 800 nm width by an anisotropic etching in an aqueous solution of potassium chloride.