Analysis of thermal boundary conductance at diamond/copper interface and fabrication of high thermal-conductivity composite

Presentation information

Oral presentation

22 Joint Session M ”Phonon Engineering” » 22.1 Joint Session M "Phonon Engineering"

Sat. Mar 9, 2019 1:45 PM - 6:15 PM W371 (W371)

Yoshiaki Nakamura(Osaka Univ.), Takanobu Watanabe(Waseda Univ.), Hiroya Ikeda(Shizuoka Univ.)

2:45 PM - 3:00 PM

〇(PC)BIN XU¹, Shih-Wei Hung¹, Junichiro Shiomi¹ (1.Univ. Tokyo)

Keywords:high thermal conductivity