The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

3 Optics and Photonics » 3.7 Laser processing

[9p-W631-1~11] 3.7 Laser processing

Sat. Mar 9, 2019 1:45 PM - 4:45 PM W631 (W631)

Yasutaka Hanada(Hirosaki Univ.), Mitsuhiro Terakawa(Keio Univ.)

3:00 PM - 3:15 PM

[9p-W631-6] Al doping of 4H-SiC by excimer laser irradiation to Al2O3 thin films

〇(B)Kosei Kamada1, Toshifumi Kikuchi1,2, Daisuke Nakamura1, Hiroshi Ikenoue1,2 (1.Kyushu Univ., 2.Dept. of Gigaphoton Next GLP, Kyushu Univ.)

Keywords:4H-SiC, excimer laser, laser doping

Silicon carbide is well known wide bandgap semiconductor and superior material properties. However, fabrication cost of SiC power device become very high and carbon atoms may segregate from SiC, because high temperature ion implantation and annealing are needed for doping. Therefore, law-temperature process for doping are needed for spread of SiC power devices. We have investigated a laser doping method for high-concentration, low-temperature doping and reported that heavy Al doping of 4H-SiC can be achieved by KrF excimer laser irradiation to thin Al films formed on the SiC substrate. Recently, we have used Al2O3 film to perform laser doping of Al with lower irradiation energy than laser ablation using Al film.