The 81st JSAP Autumn Meeting, 2020

Presentation information

Oral presentation

13 Semiconductors » 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

[10p-Z09-1~20] 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

Thu. Sep 10, 2020 12:30 PM - 6:00 PM Z09

Koichiro Saga(Sony), Nobuya Mori(Osaka Univ.), Takashi Hasunuma(Univ. of Tsukuba)

12:30 PM - 12:45 PM

[10p-Z09-1] Water Flow for Quick Batch-Type Silicon Wafer Wet Cleaninig

Toshinori Takahashi1, Habuka Hitoshi1, Goto Akihiro2 (1.Yokohama Nat. UniV, 2.Pre--Tech)

Keywords:silicon wafer wet cleaning bath, water flow

In order to prevent contamination from circulating in the wet cleaning bath for semiconductor silicon wafers, in the previous report, we proposed that pinholes be set up on the upper ends of the four walls of the cleaning bath, and verified by visualization experiments. In order to create a flow that can be cleaned in shorter time, we examined a structure which has pinholes on the upper ends of the two side walls of the cleaning bath.