The 81st JSAP Autumn Meeting, 2020

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Oral presentation

12 Organic Molecules and Bioelectronics » 12.7 Biomedical Engineering and Biochips

[9a-Z12-1~11] 12.7 Biomedical Engineering and Biochips

Wed. Sep 9, 2020 9:00 AM - 12:00 PM Z12

Toshihiko Noda(Toyohashi Univ. of Tech.), Tetsu Tanaka(Tohoku Univ.)

10:15 AM - 10:30 AM

[9a-Z12-6] Flexible 3D-Wrinkled Wire Formation for In-Mold Electronics

〇Shuta Nagata1, Hisashi Kino2, Tetsu Tanaka1,3, Takafumi Fukushima1,3 (1.Graduate School of Engineering, Tohoku Univ., 2.FRIS, Tohoku Univ, 3.Graduate School of Biomedical Engineering, Tohoku Univ.)

Keywords:In-mold electronics, Flexible hybrid electronics