The 67th JSAP Spring Meeting 2020

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Poster presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[12a-PB4-1~13] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Thu. Mar 12, 2020 9:30 AM - 11:30 AM PB4 (PB)

9:30 AM - 11:30 AM

[12a-PB4-7] Data Compression Technique with Vth Modulation for 3D TLC NAND Flash Memory

〇Yudai Mori1, Kyosuke Maeda1, Ken Takeuchi1 (1.Chuo Univ.)

Keywords:NAND-frash memory