Thick Film Formation of Conductive Patterns Using Cu Pastes containing a Cu nano particle by Screen Printing

HIDEO TOKUHISA; REIKO AZUMI

Presentation information

Oral presentation

Code-sharing Session » 【CS.6】 Code-sharing Session of 8.3 & 9.2 & 13.6

[12p-D511-1~13] 【CS.6】 Code-sharing Session of 8.3 & 9.2 & 13.6

Thu. Mar 12, 2020 1:45 PM - 5:15 PM D511 (11-511)

Kazunori Koga(Kyushu Univ.), Shinya Kano(AIST)

4:15 PM - 4:30 PM

[12p-D511-10] Thick Film Formation of Conductive Patterns Using Cu Pastes containing a Cu nano particle by Screen Printing

〇HIDEO TOKUHISA¹, REIKO AZUMI¹ (1.AIST)

Keywords:nano particles, screen printing, thick films

In this study, we have studied whether screen printed patterns can form a thick film for the application demanding a large current like power semiconductor devices by preparing Cu pastes containing bare Cu nano particles filled with a self-reductive Cu formate to supress the volume shrinkage. The changes of morphology and electric resistance were investigated.