5:00 PM - 5:15 PM
[13p-D419-12] Estimation of thermal resistance of β-Ga2O3 Schottky barrier diode packages fabricated by flip chip bonding technique
Keywords:Ga2O3, Thermal resistance, Flip chip bonding technique
Oral presentation
Joint Session K "Wide bandgap oxide semiconductor materials and devices" » 21.1 Joint Session K "Wide bandgap oxide semiconductor materials and devices"
Fri. Mar 13, 2020 1:45 PM - 6:15 PM D419 (11-419)
Takashi Yasuda(Ishinomaki Senshu Univ.), Takumi Ikenoue(Kyoto Univ.)
5:00 PM - 5:15 PM
Keywords:Ga2O3, Thermal resistance, Flip chip bonding technique