The 67th JSAP Spring Meeting 2020

Presentation information

Oral presentation

3 Optics and Photonics » 3.15 Silicon photonics and integrated photonics

[15a-B508-1~8] 3.15 Silicon photonics and integrated photonics

Sun. Mar 15, 2020 9:30 AM - 11:45 AM B508 (2-508)

Shota Kita(NTT), Hiromasa Shimizu(TUAT)

11:15 AM - 11:30 AM

[15a-B508-7] Observation of Sub-bandgap Photodetection at 2 μm wavelengths in a Germanium Lateral PIN Photodetector

〇(DC)Ziqiang Zhao1, Chongpei Ho1, Qiang Li1, Kasidit Toprasertpong1, Shinichi Takagi1, Mitsuru Takenaka1 (1.The Univ. of Tokyo)

Keywords:germanium, mid infrared, photodetector

Being boosted by the crying needs for high-speed and broadband data communication, silicon photonics has attracted people's attention not only in the near-infrared but also in the mid-infrared wavelengths. Moreover, with the evolution of low-loss hollow-core optical fibers and thulium or holmium optical amplifiers, developments of photonic building blocks for MIR have been promoted. Particularly, monolithic silicon photodetectors operating at sub-bandgap wavlengths, i.e. 2 μm, through defects mediation have been reported. In this work, we reported sub-bandgap photodetection in germanium lateral PIN photodectors on Germanium-on-insulator wafer operating at 2 μm wavelengths for the first time, attributable to defects mediated mechanism.