Tolerance to hygrothermal stress for thin-film Si photovoltaic modules using polyvinyl butyral encapsulants

Atsushi Masuda; Kinichi Ogawa; Yasuo Chiba; Hirotaka Yasuda; Shinichi Muguruma

Presentation information

Oral presentation

16 Amorphous and Microcrystalline Materials » 16.3 Bulk, thin-film and other silicon-based solar cells

[10a-N104-1~9] 16.3 Bulk, thin-film and other silicon-based solar cells

Fri. Sep 10, 2021 9:00 AM - 11:30 AM N104 (Oral)

Yasushi Sobajima(Gifu Univ.)

9:45 AM - 10:00 AM

[10a-N104-4] Tolerance to hygrothermal stress for thin-film Si photovoltaic modules using polyvinyl butyral encapsulants

〇Atsushi Masuda¹, Kinichi Ogawa², Yasuo Chiba², Hirotaka Yasuda³, Shinichi Muguruma³ (1.Niigata Univ., 2.AIST, 3.Kuraray)

Keywords:photovoltaic modules, polyvinyl butyral, thin-film silicon

Retention of output power for thin-film Si photovoltaic modules above 85% was kept after damp-heat test for 50000 h if using polyvinyl butyral (PVB) encapsulants instead of ethylene vinyl acetate (EVA) encapsulants.